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Chinese Chinese Products Equipment Series Equipment Series Unpatterned Wafer Defect Inspection Equipment Series Patterned Wafer Defect Inspection Equipment Series Metrology Equipment Series Overlay Metrology Equipment Series 3D Surface Profiling Metrology Equipment Series Dielectric Film Metrology Equipment Series Software series Software Yield Management System DMS/YMS Semiconductor Auto Defect Classification System Skyverse Company Introduction Development History Corporate Culture Certificates of Honor News News Recruitment Social Recruitment Campus Recruitment Contact Investor Relations Dielectric Film Metrology Equipment Series LATIFILM Home > Products > Metrology Equipment Series Product Introduction This series of equipment is primarily designed for nano-level measurements of single/multi-layer film and metal film thickness on wafers. Employing ellipsometry and spectral reflection technologies, it achieves rapid and high-precision measurement of thin film thickness and n-k values. Its primary application is in the front-end of integrated circuit. Product Features 1、Provides high-precision and highly-repeatable film thickness measurement for multiple design nodes,wide spectroscopic ellipsometer, laser ellipsometer, reflection-type film thickness gauge, stress and various other non-contact optical probes are available to cater to diverse measurement scenarios. 2、Automatic measurement task deployment and result reporting reduce labor costs. 3、Multi-dimensional measurement result evaluation visualizes process-related issues. 4、Offline analysis and batch importing optimize the time usage.   Previous Product 3D Surface Profiling Metrology Equipment Series CYPRESS Next Product Null Products Equipment Series Software series Skyverse Company Introduction Development History Corporate Culture Certificates of Honor News News Recruitment Social Recruitment Campus Recruitment Contact Investor Relations All rights reserved. Infringement will be investigated. 粤ICP备16055877号 WeChat QR Code -->

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